| 摘要 |
An aqueous slurry comprises 0.01-25 wt.% oxidizing agent, 0.1-50 wt.% abrasive particles, 0.001-3 wt.% polyvinyl pyrrolidone, 0.01-10 wt.% azole inhibitor for decreasing static etch of copper interconnects, 0.001-5 wt.% phosphorus-containing compound for increasing removal rate of the copper interconnects, 0.001-10 wt.% organic complexing agent formed during polishing, and balance water. The aqueous slurry has a pH of >=8. |
