发明名称 GROOVE PROCESSING TOOL FOR SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a groove processing tool that can perform groove processing by reciprocal movement, and is small in variation in the width of a blade caused by abrasion, and achieved in long lifetime. <P>SOLUTION: The groove processing tool 2 is held by a holder 17 and moved on a substrate reciprocally and relatively together with the holder 17 to form a groove at the substrate, and includes a tool body 36 held by the holder 17 and a cutting edge 37. The cutting edge 37 has a first blade 38a formed at a tip of the tool body 36 and formed at a top on a forward-movement side in a moving direction, and a second blade 38b formed at a top on a backward-movement side, and the first blade 38a and the second blade 38b successively adjoin. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013071316(A) 申请公布日期 2013.04.22
申请号 JP20110212148 申请日期 2011.09.28
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SOYAMA MASANOBU
分类号 B28D5/04;H01L21/304;H01L31/04 主分类号 B28D5/04
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