发明名称 LED PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED package which achieves excellent heat radiation performance. <P>SOLUTION: An LED package includes: a substrate where an LED element is mounted; a heat radiation member having a mounting surface of the substrate; an annular elastic deformation member which is disposed at an outer peripheral part of an LED element mounting surface of the substrate; a pressing member disposed on a surface of the elastic deformation member which is the opposite side of the substrate; and a fastening member fastening the pressing member to the heat radiation member. Fastening force of the fastening member causes to the pressing member and the heat radiation member to approach each other, and the pressing member presses and fixes the substrate to the heat radiation member through the elastic deformation member in the state that the pressing member and the heat radiation member approach each other. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013074274(A) 申请公布日期 2013.04.22
申请号 JP20110214632 申请日期 2011.09.29
申请人 CCS INC 发明人 YONEDA KENJI
分类号 H01L33/00;H01L33/64 主分类号 H01L33/00
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