| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin-film wiring board which is high in electrical connection reliability between a through conductor and a thin film wiring layer and a wiring conductor. <P>SOLUTION: The thin-film wiring board includes a ceramic board 1 in which a wiring conductor 11 is formed on its upper surface, a junction layer 2 which is stacked on an upper surface of the ceramic board 1, and a thin film wiring layer 3 which is stacked on an upper surface of the junction layer 2. The junction layer 2 is provided with a through conductor 21, and the wiring conductor 11 of the ceramic board 1 is electrically connected to the thin film wiring layer 3 through the through conductor 21. The through conductor 21 is a thin-film wiring board in which elasticity at an upper end part 21a and a lower end part 21b is smaller than that at a central part 21c. A thermal stress is relaxed at the upper and lower end parts 21a and 21b of the through conductor 21, thereby suppressing cracking or the like under thermal stress at the upper and lower end parts 21a and 21b of the through conductor 21. Thus, electrical connection reliability is high between the wiring conductor 11 and the thin film wiring layer 3 and the through conductor 21. <P>COPYRIGHT: (C)2013,JPO&INPIT |
