| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of having a stable conductive connection between a first conductive layer and a second conductive layer in a configuration in which the first conductive layer formed on a first insulating layer is conductively connected to the second conductive layer formed on a second insulating layer laminated on the first conductive layer through a via hole part. <P>SOLUTION: A via hole part 10, formed in a wiring board 1 which is formed by laminating a resin layer 2, conductive layer 3, and resin layer 4, includes a first region 11 where only the resin layer 4 is removed and the conductive layer 3 is not removed and a second region 12 where the resin layer 4 and the conductive layer 3 are removed, wherein a portion of the conductive layer 3 which is not removed by the first region 11 is conductively connected to a portion other than the via hole part 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
