| 摘要 |
<P>PROBLEM TO BE SOLVED: To form, with high insulation quality and high connection credibility, a skip via or a through hole penetrating a support substrate of the center of an inner-layer flexible wiring board. <P>SOLUTION: A prepared hole is formed on a support film of a flexible wiring board by laser drilling, and the prepared hole is filled with resin of an adhesive layer of a copper-foiled coverlay film, thereby manufacturing an inner-layer flexible wiring board. At a position of the prepared hole filled with the resin, a hole for skip via or a hole for through hole penetrating the support film is formed with a diameter smaller than that of the prepared hole by layer drilling, the hole for skip via or the hole for through hole is desmeared, and the hole for skip via or the hole for through hole is filled with copper plating, thereby forming a skip via or a through hole. <P>COPYRIGHT: (C)2013,JPO&INPIT |
