METHOD FOR MANUFACTURING COPPER CLAD FILM FOR CCL

摘要

PURPOSE: A method for manufacturing a copper clad film for manufacturing a copper clad laminate with a carrier layer made of aluminum is provided to improve etching efficiency by bonding a plating layer to the carrier layer using an electroless plating method. CONSTITUTION: A carrier layer(110) is made of aluminum. An electroless copper clad layer(120) is formed on the carrier layer by an electroless plating method. An uneven plating layer(131) is formed on the outer side of the electroless copper clad layer to be bonded to a prepreg. The uneven plating layer is made of the same copper materials as the copper clad layer and increases a contact area with the prepreg through an uneven shape.