| 摘要 |
PURPOSE: A substrate processing apparatus is provided to improve the gas flow of a gas injecting part using a main guide part for gas and to uniformly treat a substrate. CONSTITUTION: A process chamber has a sealing space for treating a substrate. A substrate support unit for mounting the substrate is positioned in the process chamber. A gas injection part(140) is installed at the upper part of a process space and sprays gas to the process space. The gas injection surface(141) of the gas injection part has a rectangular shape. A main guide part(210) guides the flow of gas discharged from the gas injection part. The slope angle of the guide face(221) of a corner guide part(220) is smaller than that of the guide face(211) of the main guide part. |
