| 摘要 |
The present invention provides a method for breaking a thin substrate with thickness less than 1.0 mm without affecting the elements formed on the substrate. According to the invention, a trigger portion is formed on the base end part of a pre-determined breaking line on the edge of one side of a thin substrate made of brittle material. Next, a laser beam is used to scan along the pre-determined breaking line from a position corresponding to the trigger portion on a face opposite to the face of trigger portion as a starting point, and subsequently a coolant is ejected on the heated portion for breaking the substrate along the pre-determined breaking line. |
