| 摘要 |
The present invention includes a C-type resin clip projecting from an exterior surface on a band tightener in a band-type wire harness mount or from a front surface on a middle portion of a substrate in a substrate-type wire harness mount, and a C-type metal clip having a length shorter than the C-type resin clip. The C-type metal clip is mounted between upper and lower tabs of the C-type resin clip. A pressing projection is provided on opposing interior surfaces of each of the upper and lower tabs of the C-type resin clip, and a press-down tab is provided on the upper and lower tabs of the C-type metal clip. When a bracket is pressed in between the upper and lower tabs of the C-type metal clip, the press-down tabs are lifted by the pressing projections and both the upper and lower surfaces of the bracket are pinched and held.
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