| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of producing a polishing pad improved in all of planarization, a removal rate and a defect rate. <P>SOLUTION: A method forms a layered open-network polishing pad which can be used for polishing at least one of magnetic, semiconductor and optical substrates. First and second polymer sheets or films of a curable polymer are exposed to an energy source and an exposure pattern having elongated sections exposed to the energy source is formed on the first and second polymer sheets. Then by removing polymer from the exposed first and second polymer sheets, elongated channels extending throughout the entire thickness of the first and second polymer are formed into a channel pattern that corresponds to the exposure pattern, throughout the entire first and second polymer sheets. The first and second polymer sheets are joined together to form the layered open-network polishing pad. <P>COPYRIGHT: (C)2013,JPO&INPIT |
