发明名称 CHIP TYPE LAMINATED CAPACITOR
摘要 There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 mum or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 mum or less.
申请公布号 US2013094123(A1) 申请公布日期 2013.04.18
申请号 US201213693947 申请日期 2012.12.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 AHN YOUNG GHYU;LEE BYOUNG HWA;PARK MIN CHEOL;SONG YOUNG HOON;LEE MI HEE
分类号 H01G4/12 主分类号 H01G4/12
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