发明名称 |
ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a rolled copper foil not causing cracks in wiring even when used as wiring of a printed wiring board for a long time; a copper-clad laminate using the same; a flexible printed wiring board; and electronic devices. <P>SOLUTION: This rolled copper foil is such that: when the crystal grain boundary is defined as a site with ≥15° azimuth angle difference between a crystal orientation obtained by irradiating a measuring point of a crystal metal structure with electron beams and a crystal orientation obtained by irradiating a plurality of adjacent measuring points positioned around the measuring point while being apart by 0.5 μm with electron beams, the length of the crystal grain boundary measured after annealing at 400°C for 1 hour is 95 cm/mm<SP POS="POST">2</SP>or shorter. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013067853(A) |
申请公布日期 |
2013.04.18 |
申请号 |
JP20110211384 |
申请日期 |
2011.09.27 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
OKANO TOMOKI |
分类号 |
C22C9/00;B32B15/08;C22C9/02;C22C9/04;C22F1/00;C22F1/08 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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