发明名称 ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a rolled copper foil not causing cracks in wiring even when used as wiring of a printed wiring board for a long time; a copper-clad laminate using the same; a flexible printed wiring board; and electronic devices. <P>SOLUTION: This rolled copper foil is such that: when the crystal grain boundary is defined as a site with &ge;15&deg; azimuth angle difference between a crystal orientation obtained by irradiating a measuring point of a crystal metal structure with electron beams and a crystal orientation obtained by irradiating a plurality of adjacent measuring points positioned around the measuring point while being apart by 0.5 &mu;m with electron beams, the length of the crystal grain boundary measured after annealing at 400&deg;C for 1 hour is 95 cm/mm<SP POS="POST">2</SP>or shorter. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013067853(A) 申请公布日期 2013.04.18
申请号 JP20110211384 申请日期 2011.09.27
申请人 JX NIPPON MINING & METALS CORP 发明人 OKANO TOMOKI
分类号 C22C9/00;B32B15/08;C22C9/02;C22C9/04;C22F1/00;C22F1/08 主分类号 C22C9/00
代理机构 代理人
主权项
地址