| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that the shortage of wet spreading of an adhesive occurs only in a coating pattern and it is difficult to uniform the thickness of the adhesive, in bonding and fixing of a base and a circuit board. <P>SOLUTION: An electronic circuit device is configured such that an electronic circuit assembly for controlling the transmission and driving machine of an automobile, a base for fixing the electronic circuit assembly, and a lead terminal, to which the electronic circuit assembly is electrically connected, are sealed with mold resins. The electronic circuit device is formed into an adhesive fixing structure where on the adhesive side face of the circuit board of the electronic circuit assembly, concave-convex slit patterns are radially formed by a solder resist continuously to the end of the circuit board and a flow path is disposed to uniformly wet and spread the adhesive. <P>COPYRIGHT: (C)2013,JPO&INPIT |
