| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which can improve the moisture resistance reliability when a copper wire is used, and can suppress the deformation of the copper wire and the warpage of a package; and to provide a semiconductor device using the same. <P>SOLUTION: In the epoxy resin composition for sealing a semiconductor, which contains an epoxy resin, a curing agent and an inorganic filler as essential components, and is used as a molding material of an area-packaging-type package using a copper wire for electric connection of a semiconductor element, the epoxy resin contains a biphenyl type epoxy resin represented by formula (I) and having a hydrolyzable chlorine content of 10 to 20 ppm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
