| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for soldering a micro electronic component or a flexible substrate. <P>SOLUTION: A method of soldering an electronic component includes a step in which a first pressing plate, a first mesh, and a plate containing a plurality of holes are stacked in order, a step in which the electronic component is inserted in the hole of the plate, a step in which a second mesh and a second pressing plate are sequentially stacked on the plate into which the electronic component has been inserted, to form a workpiece, a step in which soldering is made on the electronic component in the workpiece, and a step in which, after performing the soldering, an excessively sticking solder is scraped off by jetting an organic fatty acid solution. The soldering step is characterized by jetting solder in such vigor as the electronic component is moved in the hole of the plate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
