发明名称 |
WAFER LEVEL PACKAGING OF SEMICONDUCTOR CHIPS |
摘要 |
A method of manufacturing semiconductor packages at the wafer level is disclosed. A wafer has multiple integrated circuits (ICs) formed on its active surface, with each IC in communication with a plurality under-bump metallization (UBM) pads formed on one surface the package. The UBM pads include a larger pads near the center of package and smaller UBM pads near the periphery. The method includes attaching a stiffener to an inactive surface of the wafer; forming under bump metallization pads; and forming solder bumps extending from the UBM pads.
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申请公布号 |
US2013095614(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201213690838 |
申请日期 |
2012.11.30 |
申请人 |
ATI TECHNOLOGIES ULC;ATI TECHNOLOGIES ULC |
发明人 |
MCLELLAN NEIL;ZBRZEZNY ADAM |
分类号 |
H01L21/50;H01L21/78 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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