| 摘要 |
<p>PURPOSE: An LED package is provided to efficiently dissipate the heat emitted from the LED chip using a heat radiation pad connected to a heat radiation via. CONSTITUTION: A lower plate(101) has a laminated ceramic sheet(101a-101e). An LED chip(301) is mounted on the upper surface of a lower substrate. An upper substrate(201) is arranged on the lower substrate. A heat radiation part releases the heat generated from the LED chip from the upper surface of the lower substrate to the lower surface. The heat radiation includes a heat radiation via(13,17,21,25) and a heat radiation pad(15,19,23,27). The heat radiation pad is formed in the outer part of the heat radiation via and a laminated surface.</p> |
