发明名称 |
ELECTRONIC DEVICE AND HEAT SINK EMPLOYING THE SAME |
摘要 |
A heat sink is used to cool electronic components, and includes a metal base portion, a motherboard and a heat conducting sheet. The motherboard and the heat conducting sheet are positioned on the metal base portion. The motherboard includes a copper foil. The electronic components are electrically connected on the copper foil; the heat conducting sheet is positioned between the metal base portion and the motherboard, and contacts the metal base portion and the motherboard. The heat of the electronic components is conducted to the metal base portion through the copper foil, the motherboard and the heat conducting sheet.
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申请公布号 |
US2013094152(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201213455818 |
申请日期 |
2012.04.25 |
申请人 |
LI HUI;PAN YA-JUN;GE TING;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. |
发明人 |
LI HUI;PAN YA-JUN;GE TING |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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