Apparatus for mounting of substrate structure e.g. wafer, has bearing surface engaged with mating surface of substrate structure such that air cushion is generated by flow of compressed air between surfaces to form bearing gap

摘要

The mounting apparatus (11) has a porous bearing (12) that is adhered with translucent acrylic glass or transparent plastic particles (14) by bonding agent. Several openings (15) are formed in the air bearing surface (13) of porous bearing for passage of compressed air or for applying low pressure. The bearing surface is engaged with mating surface (19) of substrate structure (18) such that the air cushion is generated by flow of compressed air between bearing surface and mating surface to form a bearing gap (20) between bearing and mating surfaces.