发明名称 PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a paste and method which enables at least one electronic component to be connected to at least one substrate through contact regions at least one of which contains a non-noble metal. <P>SOLUTION: The paste contains (a) metal particles, (b) at least one activator that bears at least two carboxylic acid units in the molecule, and (c) a dispersion medium. The method for connecting at least one electronic component to at least one substrate through the contact regions at least one of which contains a non-noble metal includes the step of preparing the paste. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013069687(A) 申请公布日期 2013.04.18
申请号 JP20120206006 申请日期 2012.09.19
申请人 HARAEUS MATERIALS TECHNOLOGY GMBH & CO KG 发明人 SCHAEFER MICHAEL;WOLFGANG SCHMIDT;ALBERT HEILMANN;JENS NACHREINER
分类号 H01B1/22 主分类号 H01B1/22
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