| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which can be reduced in warpage, and a method for manufacturing the same. <P>SOLUTION: The semiconductor package comprises: a first sealing insulating layer for sealing a circuit formation surface and a side surface of a first semiconductor chip; wiring layers and insulating layers which are laminated on a first surface, i.e., a surface on the circuit formation surface side of the first sealing insulating layer; a second semiconductor chip mounted on the insulating layers; and a second sealing insulating layer which is formed on the insulating layers so as to seal the second semiconductor chip. <P>COPYRIGHT: (C)2013,JPO&INPIT |
