| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an acoustic wave device and a method of manufacturing the same which can make a height of a bump electrode and a height of a seal ring the same level and achieve reduction in the manufacturing man-hours and improvement in quality. <P>SOLUTION: A method of manufacturing an acoustic wave device includes the steps for: forming a plurality of surface acoustic wave elements 14 on a substrate 10; simultaneously forming a plurality of bump electrodes 44 electrically connected to the plurality of surface acoustic wave elements 14 respectively and a plurality of seal rings 46 respectively surrounding a portion of the plurality of surface acoustic wave elements 14 and a portion of the plurality of bump electrodes 44 electrically connected to the portion of the surface acoustic wave elements 14 as a set on the substrate 10 by an electrolytic plating method; and electrically separating the bump electrodes 44 electrically connected to the surface acoustic wave elements 14 formed into individual pieces and the seal rings 46 surrounding the surface acoustic wave elements 14 formed into the individual pieces by forming the plurality of surface acoustic wave elements 14 into the individual pieces and cutting an electric supply line for plating used in the electrolytic plating method. <P>COPYRIGHT: (C)2013,JPO&INPIT |
