| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance mounting density of an arithmetic element and a memory element and obtain cooling performance suitable for the mounting density. <P>SOLUTION: In a mounting structure of electronic components for mounting electronic components generating heat due to operation on a mother board 1 detachably housed in a rack, a plurality of pairs of an arithmetic element and a memory element are mounted on a sub board 3; a terminal for electrical connection is provided in one side part of the sub board; and a plurality of rows of sockets inserted by the terminal are provided on the mother board 1; and a plurality of the sub boards 3 are inserted into the respective sockets so as to mutually be parallel at a constant interval and are held vertically standing to the mother board 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
