| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus that can contribute to uniformization of a film thickness of a film deposited to a substrate, wherein the vapor deposition apparatus serves as a device for heating a deposition material, which can heat a material container so that the vicinity of the peripheral part of the material container is heated to a higher temperature than the vicinity of the center part thereof, and can readily control a temperature difference between near the center part of a deposition material stored in the material container and near the peripheral part thereof, thereby improving responsiveness to a vaporization quantity change of the deposition material; to provide a vapor deposition method; and to provide a substrate having a film with a uniform film thickness. <P>SOLUTION: The device for heating a deposition material includes: the material container 14 for storing the deposition material 13; a heater 15 disposed on a side of a bottom surface of the material container 14 and heating the deposition material 13; and a temperature control unit for controlling a heating temperature for the deposition material 13 by the heater 15 according to a heating region oriented from the center of the material container 14 toward an outer periphery thereof. <P>COPYRIGHT: (C)2013,JPO&INPIT |
