发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 A substrate can be appropriately oxidized, while oxidation of the substrate can be suppressed. The present invention includes a step of generating mixed plasma by causing a mixed gas of hydrogen (H2) gas and oxygen (O2) or oxygen-containing gas supplied to a processing chamber to form a plasma discharge, and processing the starting substrate by the mixed plasma; and a step of generating hydrogen plasma by causing hydrogen (H2) gas supplied to the processing chamber to form a plasma discharge, and processing the substrate by the hydrogen plasma.
申请公布号 US2013095669(A1) 申请公布日期 2013.04.18
申请号 US201213672282 申请日期 2012.11.08
申请人 HITACHI KOKUSAI ELECTRIC INC.;HITACHI KOKUSAI ELECTRIC INC. 发明人 UEDA TATSUSHI;TERASAKI TADASHI;OGAWA UNRYU;HIRANO AKITO
分类号 H01L21/02;C23C16/50;C23F1/00;C23F1/08 主分类号 H01L21/02
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