LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An LED package and a method for manufacturing the same are provided to separate a line pattern from a reflection layer without using a dummy sheet and to reduce the cost for the dummy sheet. CONSTITUTION: A line pattern(110) for electrically connecting an LED chip and a heat radiation pattern(130) for dissipating the heat generated from the LED chip are formed on a lower substrate(101). The line pattern includes an upper line pattern(15), a lower line pattern(11), and a line via(13). The heat radiation pattern includes an upper heat radiation pattern(35), a lower heat radiation pattern(31), and a heat radiation via(33). An upper substrate(201) is arranged on the lower substrate. A reflection layer(21) is successively formed in a sidewall and the upper and lower surfaces of the upper substrate connected to the sidewall. A separation part(51) has a groove structure formed in the lower substrate.