| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized semiconductor package excellent in reduction in size, high density, and reliability by preventing reflow crack, and to provide a substrate for mounting a semiconductor that can be used for the semiconductor package and a method of manufacturing the semiconductor package and the substrate. <P>SOLUTION: A substrate for mounting a semiconductor includes an insulating substrate material 1 and a conductor pattern 5. The insulating substrate material is formed of a resin having a post-hardening thermal expansion coefficient of 50×10<SP POS="POST">-6</SP>/°C or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
