| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal treatment method and a thermal treatment apparatus which perform flash heating treatment while inhibiting adverse effects on a substrate. <P>SOLUTION: A semiconductor wafer W where a resist film is formed on a surface is carried into a chamber 6 of a thermal treatment apparatus 1 to be held by a holding plate 7. In a filter mechanism 2, a filter 20, which cuts light of a wavelength region at which the resist film is exposed, is inserted between a chamber window 61 of the chamber 6 and a flush lamp FL of a flush radiation part 5. When flush light emitted from the flash lamp FL penetrates into the filter 20, the light of the wavelength region is cut, and the flush light after the cut is radiated to a surface of the semiconductor wafer W. The radiation of the flush light in which the light of the wavelength region is cut enables necessary flush heating treatment to be performed while inhibiting the exposure of the resist film. <P>COPYRIGHT: (C)2013,JPO&INPIT |
