发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly reliable compound semiconductor device capable of surely inhibiting deterioration (chemical and physical change) in device properties in spite of a high voltage of an operating voltage and achieving a high withstanding voltage and a high output. <P>SOLUTION: The compound semiconductor device according to an embodiment comprises: a first protection film 6 composed of a homogeneous and same material (here, SiN) having a homogenous dielectric constant for covering a top face of a compound semiconductor layer 2; a protection part containing oxygen on one end part of an opening 6a of the first protection film 6, which is a second protection film 7a of an oxide film formed on the one end part to cover the one end part; and a gate electrode 8 in an overhang shape filling the opening 6a and embracing the second protection film 7a. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013069810(A) 申请公布日期 2013.04.18
申请号 JP20110206553 申请日期 2011.09.21
申请人 FUJITSU LTD 发明人 MAKIYAMA KOZO;YOSHIKAWA SHUNEI
分类号 H01L21/338;H01L21/28;H01L21/283;H01L29/778;H01L29/812 主分类号 H01L21/338
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