发明名称 INTEGRATED MICRONEEDLE ARRAY DELIVERY SYSTEM
摘要 <p>The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device.</p>
申请公布号 WO2013055638(A1) 申请公布日期 2013.04.18
申请号 WO2012US59273 申请日期 2012.10.09
申请人 3M INNOVATIVE PROPERTIES COMPANY;COLBURN, DAVID J.;JOHNSON, ERIK J.;BRANDWEIN, DAVID H.,;GYSBERS, JEROME E.;YOUNG, PATRICK J.;CANTOR, ADAM S. 发明人 COLBURN, DAVID J.;JOHNSON, ERIK J.;BRANDWEIN, DAVID H.,;GYSBERS, JEROME E.;YOUNG, PATRICK J.;CANTOR, ADAM S.
分类号 A61M5/00 主分类号 A61M5/00
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