| 摘要 |
PURPOSE: An exposure mask for a wafer level package and a method for manufacturing the package using the same are provided to prevent misalignment by forming a first and a second aligners in an exposure mask. CONSTITUTION: A wafer pattern region(202) forms a die street pattern. The die street pattern separates multiple die patterns from one another. A first aligner(204) separates the wafer pattern region to surround the wafer pattern region. A pair of second aligners(206a,206b) is closely formed in all sides of the wafer pattern region. The second aligner includes align patterns. |
