| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board of higher definition than before by preventing abnormal deposition of a protection metal, and conduction between terminal conductor layers due to bridge phenomenon even if the space between terminal conductor layers is narrowed, when a protection metal coating layer is formed on the surface of the terminal conductor layer out of the conductor layer, in a single-sided printed wiring board where the conductor layer is patterned on one side of an insulation substrate. <P>SOLUTION: In the single-sided printed wiring board where a conductor layer 12 is embedded on one surface (first surface) side of an insulation substrate 10, and a protection metal coating layer 14 is formed on the surface of a terminal conductor layer 12a out of the conductor layer, the terminal conductor layer is formed in a state where the surface is sinking from the first surface 10A of the insulation substrate. The sunken surface of the conductor layer is covered with a coating layer, and the surface of the coating layer is located substantially in flush with the first surface of the insulation substrate or below. Opening holes 13A and 13B are formed from the surface (second surface) 10B of the insulation substrate on the opposite side so as to reach the conductor layer in the insulation substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
