| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a copper conductive film revealing adhesiveness of a substrate and a copper conductive film obtained from a copper conductor ink without lowering the conductivity of the copper conductor film of paste containing copper oxide particles, and to provide a printed copper pattern obtained by that method. <P>SOLUTION: In the manufacturing method of a copper conductive film, a paste containing copper oxide nano particles is deposited on a substrate having a roughened surface, and the deposition layer is subjected to formic acid gas treatment to produce a copper film. The ratio (Ra/primary particle size) of the arithmetic average roughness Ra of the substrate having a roughened surface and the primary particle size of copper oxide particles contained in the paste is preferably 1.5 or higher. Furthermore, the paste contains copper oxide nano particles where 90 mass% or more of particle composition consists of copper oxide (I) or copper oxide (II), and preferably the paste is a liquid composition produced by dispersing the particles into a fluid dispersion. <P>COPYRIGHT: (C)2013,JPO&INPIT |
