发明名称 |
MULTI-DIE INTEGRATED CIRCUIT STRUCTURE WITH HEAT SINK |
摘要 |
An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the first die can be coupled to the second surface of the second die. The integrated circuit structure also can include a heat sink coupled to the first surface of the first die and the first surface of the second die.
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申请公布号 |
US2013093074(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201113272500 |
申请日期 |
2011.10.13 |
申请人 |
GRANT DOUGLAS M.;XILINX, INC. |
发明人 |
GRANT DOUGLAS M. |
分类号 |
H01L23/34;H01L23/498;H01L23/522 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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