<p>A method for etching a substrate includes etching at least one first layer of the substrate with a non-uniform substrate temperature and etching at least one second layer of the substrate with uniform substrate temperatures.</p>
申请公布号
WO2013055488(A1)
申请公布日期
2013.04.18
申请号
WO2012US55086
申请日期
2012.09.13
申请人
APPLIED MATERIALS, INC.;DOAN, KENNY, LINH;KIM, JONG, MUN