CONDUCTIVE PASTE, AND CONJUGATE OBTAINED BY BURNING CONDUCTIVE PASTE

摘要

PROBLEM TO BE SOLVED: To provide conductive paste that can be suppressed from explosively boiling when heated or sintered.

SOLUTION: Conductive paste has metal fine particles (P) and dispersant (D) whose rate (P/D) (weight%)is set to 50 to 90/50 to 10. The dispersant (D) is an organic dispersant (D1) comprising an organic solvent and a bumping inhibition solvent (T). The organic solvent is formed of (i) alcohol or polyalcohol which has a boiling point of 100°C or more under normal pressure and has one or two or more hydroxyl groups (-OH) per molecule, or (ii) at least an organic solvent of 5 to 95 vol% and an organic solvent (S) of 95 to 5 vol% having an amide group. The bumping inhibition solvent (T) is a compound having a hydroxyl group and a carbonyl group and no carboxyl group, and has a molecular mass of 50 or more and a boiling point of 100°C or more. The rate (T/D1) (weight%) of the bumping inhibition solvent (T) in the organic dispersant (D1) is equal to 2 to 25 weight%.

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