发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for simply manufacturing a semiconductor device which can inhibit an off-leak current while achieving a high on-state current. <P>SOLUTION: A semiconductor device manufacturing method comprises: forming a gate insulation film on a semiconductor substrate; forming a gate electrode on the gate insulation film; introducing a first conductivity type impurity to a drain layer formation region; subsequently, performing a heat treatment to activate the first conductivity type impurity in the drain layer formation region; subsequently, introducing an inactive impurity to a source layer formation region to make single crystals of the semiconductor substrate in the source layer formation region be amorphous; subsequently, introducing a second conductivity type impurity to the source layer formation region; and subsequently, irradiating microwave on the semiconductor substrate to mono-crystallize an amorphous semiconductor at least in the source layer formation region and to activate the second conductivity type impurity in the source layer formation region. A depth of the second conductivity type impurity in the source layer formation region is shallower than a depth of the first conductivity type impurity in the drain layer formation region. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013069977(A) 申请公布日期 2013.04.18
申请号 JP20110208913 申请日期 2011.09.26
申请人 TOSHIBA CORP 发明人 MIYANO KIYOTAKA;MIYATA TOSHINORI
分类号 H01L21/336;H01L21/20;H01L21/265;H01L29/78 主分类号 H01L21/336
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