发明名称 |
METHOD OF CUTTING LIGHT EMITTING ELEMENT PACKAGES EMPLOYING CERAMIC SUBSTRATE, AND METHOD OF CUTTING MULTILAYERED OBJECT |
摘要 |
A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method. |
申请公布号 |
US2013095586(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201213408433 |
申请日期 |
2012.02.29 |
申请人 |
KIM EUI-SEOK;JI WON-SOO;KIM CHOO-HO;RHEE SHIN-MIN;LEE DONG-HUN;JUN HEE-YOUNG |
发明人 |
KIM EUI-SEOK;JI WON-SOO;KIM CHOO-HO;RHEE SHIN-MIN;LEE DONG-HUN;JUN HEE-YOUNG |
分类号 |
H01L21/78 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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