发明名称 LIGHT EMISSION DIODE SUPPORT FRAME CONSTRUCTION, AND MANUFACTURING METHOD THEREOF (1)
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emission diode support frame construction and a manufacturing method thereof, capable of reducing cutting cost by manufacturing a metal frame in a separation state and in a direct manner, and capable of performing a lighting test and quality confirmation during a manufacturing process. <P>SOLUTION: A metallic material is prepared which is processed as a strip material including a plurality of metal frames, to contain two electrode plates and two connection plates. Then a resin base for covering is molded on the metal frame. Further, the two electrode plates of the metal frame which are not covered with the resin base are cut. After the electrode plates are cut and only connection remains between the resin base and a connection part at a front end face of the two connection plates, die bonding, wire bonding, sealing, baking, and the like are further performed. Finally, the resin base of a light emission diode whose sealing has been completed is pushed and moved in a length direction, so that two connections of the two connection plates are separated from the resin base. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013069903(A) 申请公布日期 2013.04.18
申请号 JP20110207859 申请日期 2011.09.22
申请人 FUSHENG INDUSTRIAL CO LTD 发明人 ZHU JIN-FENG;CHEN YUAN FU
分类号 H01L33/62 主分类号 H01L33/62
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