发明名称 POSITIVE RESIST MATERIAL AND PATTERNING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist material having appropriate absorption to form a pattern on a highly reflective substrate with good pattern features, adhesiveness and embedding characteristics on a stepped substrate after exposure, and having ion implantation resistance when ion implantation is carried out, and to provide a patterning process. <P>SOLUTION: The positive resist material comprises: (A) a polymeric compound having a weight average molecular weight of 1,000 to 500,000 and including a repeating unit having a structure in which a hydrogen atom of a carboxyl group is substituted with an acid-labile group having a cyclic structure; (B) a novolac resin of a substituted or unsubstituted fluorescein as a base resin; and a photo-acid generator. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013068928(A) 申请公布日期 2013.04.18
申请号 JP20120112628 申请日期 2012.05.16
申请人 SHIN ETSU CHEM CO LTD 发明人 HATAKEYAMA JUN;KOORI DAISUKE
分类号 G03F7/004;C08F20/00;C08G8/04;G03F7/039;H01L21/027 主分类号 G03F7/004
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