发明名称 SPUTTERING TARGET, TRANSISTOR, METHOD OF MANUFACTURING SINTERED BODY, METHOD OF MANUFACTURING TRANSISTOR, ELECTRONIC COMPONENT OR ELECTRIC APPARATUS, LIQUID CRYSTAL DISPLAY DEVICE, PANEL FOR ORGANIC EL DISPLAY, SOLAR CELL, SEMICONDUCTOR DEVICE, AND LIGHT-EMITTING DIODE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a sputtering target containing WS<SB POS="POST">2</SB>as a chief constituent. <P>SOLUTION: In an embodiment, a sputtering target contains at least one element selected from the group consisting of Hf, Re, Ta, W, Nb, Zr, V, Al, In, Sn, Ga, Zn, Si, Ge, Mn, Ni, Fe, Co, Cu, Ag, Y, Sc, Mg and Ca with the total content ranging from 0.1 to 10.0 wt.%, and the remainder is composed of WS<SB POS="POST">2</SB>and inevitable impurities. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013069867(A) 申请公布日期 2013.04.18
申请号 JP20110207434 申请日期 2011.09.22
申请人 SPM AKTIENGESELLSCHAFT SEMICONDUCTOR PARTS & MATERIAL 发明人 UENO TAKASHI
分类号 H01L29/786;B22F3/10;C22C29/00;C23C14/34;H01L21/336;H01L21/363;H01L29/24;H01L31/04;H01L33/26 主分类号 H01L29/786
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