| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a desmear liquid reliably removing a smear in a non-through hole formed in a resin substrate and capable of forming a plating film excellent in adhesion without greatly damaging a surface of the resin substrate; and a desmear treatment method using the desmear liquid. <P>SOLUTION: In a desmear treatment method, a desmear liquid which includes permanganate with a concentration of 0.2-0.4 mol/L and alkali metal hydroxide and has a mole concentration ratio of permanganate to alkali metal hydroxide of from 1:5 to 1:20 is used. <P>COPYRIGHT: (C)2013,JPO&INPIT |
