| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability to a temperature cycle. <P>SOLUTION: The semiconductor device includes a first semiconductor chip, a buffer, and a terminal lead. The first semiconductor chip has a first electrode and a second electrode provided on the opposite side of the first electrode, and a current flows between the first electrode and the second electrode. The buffer has a lower metallic foil that is electrically connected to the second electrode, a ceramic piece that is provided on the second electrode via the lower metallic foil, and an upper metallic foil that is provided on the side of the ceramic piece opposite to the side on which the lower metallic foil is provided and is electrically connected to the lower metallic foil. The terminal lead has one end provided on the upper metallic foil and is electrically connected to the upper metallic foil. <P>COPYRIGHT: (C)2013,JPO&INPIT |
