发明名称 |
MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF |
摘要 |
There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.
|
申请公布号 |
US2013093556(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201213342708 |
申请日期 |
2012.01.03 |
申请人 |
LIM BONG SUP;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM BONG SUP |
分类号 |
H01F5/00;H01B13/22;H01G4/12 |
主分类号 |
H01F5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|