发明名称 MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
摘要 There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.
申请公布号 US2013093556(A1) 申请公布日期 2013.04.18
申请号 US201213342708 申请日期 2012.01.03
申请人 LIM BONG SUP;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM BONG SUP
分类号 H01F5/00;H01B13/22;H01G4/12 主分类号 H01F5/00
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