| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress cut burr from occurring in package dicing. <P>SOLUTION: In the method for manufacturing the semiconductor device, in a package dicing step, as first-stage cutting, a part of a sealing body 4h including a lead 2a is cut by a soft resin blade 11, and thereby the occurrence of the cut burr can be suppressed. After that, as second-stage cutting, only a resin portion which is a cutting residual portion 4f is cut by a hard electrocasting blade 12, thereby the occurrence of an uncut portion can be reduced because of slow progress in wear of the blade body, and as a result, the reliability of the semiconductor device is improved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
