发明名称 EPOXY RESIN-BASED COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin-based composition having both of storage stability and curing power; and a phosphorus-based curing accelerator-impregnated non-hollow porous inorganic microparticle giving an epoxy resin-based cured product excellent in heat resistance; and to provide an epoxy resin-based composition and epoxy resin-based cured products, containing such non-hollow porous inorganic microparticle. <P>SOLUTION: There are provided an epoxy resin-based composition and cured products thereof, compounded, as a curing accelerator, with a non-hollow porous inorganic microparticle impregnated with tris(4-methylphenyl)phosphine (TPTP) and comprising at least (A) an epoxy resin, (B) a phenol resin curing agent and (C) a TPTP-impregnated non-hollow porous inorganic microparticle. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013067794(A) 申请公布日期 2013.04.18
申请号 JP20120198598 申请日期 2012.09.10
申请人 HOKKO CHEM IND CO LTD 发明人 OGA MASANORI;OHASHI KENJI;KITAMURA AI
分类号 C08L63/00;C08G59/62;C08K3/00;C08K9/04 主分类号 C08L63/00
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