发明名称 Current Lead with a Configuration to Reduce Heat Load Transfer in an Alternating Electrical Current Environment
摘要 A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.
申请公布号 US2013092413(A1) 申请公布日期 2013.04.18
申请号 US201113273927 申请日期 2011.10.14
申请人 CITVER GREGORY;SINCLAIR FRANK;LISCHER D. JEFFREY;DESAI NANDISHKUMAR;VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 CITVER GREGORY;SINCLAIR FRANK;LISCHER D. JEFFREY;DESAI NANDISHKUMAR
分类号 H01B7/00;H01B5/00;H01S4/00 主分类号 H01B7/00
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