发明名称 |
Current Lead with a Configuration to Reduce Heat Load Transfer in an Alternating Electrical Current Environment |
摘要 |
A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.
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申请公布号 |
US2013092413(A1) |
申请公布日期 |
2013.04.18 |
申请号 |
US201113273927 |
申请日期 |
2011.10.14 |
申请人 |
CITVER GREGORY;SINCLAIR FRANK;LISCHER D. JEFFREY;DESAI NANDISHKUMAR;VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. |
发明人 |
CITVER GREGORY;SINCLAIR FRANK;LISCHER D. JEFFREY;DESAI NANDISHKUMAR |
分类号 |
H01B7/00;H01B5/00;H01S4/00 |
主分类号 |
H01B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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