Electronic assemblies and their manufacture are described. One assembly includes a land grid array package including a plurality of land contacts. The assembly also includes a first socket adapted to engage a first group of the plurality of land contacts, and a second socket adapted to engage a second group of the plurality of land contacts. The first socket and the second socket are each coupled to a board. The first socket and the second socket are separate structures on the board. Other embodiments are described and claimed.
申请公布号
WO2013006496(A3)
申请公布日期
2013.04.18
申请号
WO2012US45121
申请日期
2012.06.29
申请人
INTEL CORPORATION;MALLIK, DEBENDRA;SATHE, AJIT, V.