发明名称 MULTIPLE SOCKET CONCEPT
摘要 Electronic assemblies and their manufacture are described. One assembly includes a land grid array package including a plurality of land contacts. The assembly also includes a first socket adapted to engage a first group of the plurality of land contacts, and a second socket adapted to engage a second group of the plurality of land contacts. The first socket and the second socket are each coupled to a board. The first socket and the second socket are separate structures on the board. Other embodiments are described and claimed.
申请公布号 WO2013006496(A3) 申请公布日期 2013.04.18
申请号 WO2012US45121 申请日期 2012.06.29
申请人 INTEL CORPORATION;MALLIK, DEBENDRA;SATHE, AJIT, V. 发明人 MALLIK, DEBENDRA;SATHE, AJIT, V.
分类号 H01R33/76;H01L23/32 主分类号 H01R33/76
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