发明名称 Method for conversion of X-rays with directly changing semiconductor layer, involves adjusting intensity profile of infrared radiation so that intensity of radiation is decreased from surface over thickness of semiconductor layer
摘要 <p>The method involves extending surface (6) and lateral boundary surfaces (7) across the thickness of the semiconductor layer (4). The X-rays (5) is radiated to the surface of the semiconductor layer while lateral boundary surface of the semiconductor layer is irradiated with infrared radiation (3). The intensity profile (10,11) of infrared radiation is adjusted so that the intensity of infrared radiation is decreased from the surface over the thickness of the semiconductor layer. An independent claim is included for device for conversion of X-rays with directly changing semiconductor layer.</p>
申请公布号 DE102012200549(B3) 申请公布日期 2013.04.18
申请号 DE201210200549 申请日期 2012.01.16
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 SCHROETER, CHRISTIAN
分类号 G01T1/24;H01L31/117 主分类号 G01T1/24
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